Loading…
Reported covered position: N/A
How to read the money
Income and expense are whole-filing amounts associated with this lobbyist, not personal compensation or an allocated share.
No topic inference: each bill number appears in source LDA issue text assigned to this lobbyist.
A bill to extend temporarily the duty suspension on certain semi-manufactured forms of gold.
Client: MICRON TECHNOLOGY INC · Firm: KING & SPALDING LLP
Issues related to U.S. Export-Import Bank financing of semiconductor manufacturing equipment to China; Export-Import Bank Reauthorization Act of 2006 (H.R. 5068); Bills to temporarily suspend the duty on gold semiconductor bonding wire (H.R. 2469 and S. 1601); Issues related to the rule of origin for semiconductors; issues related to the proposed U.S.-Korea Free Trade Agreement Subsidies to Korean semiconductor manufacturers; issues related to the unfair trade laws; issues related to the World Trade Organization negotiations; issues related to the Continued Dumping and Subsidy Offset Provision;
Specific issues are shown only where the LDA source assigned them to this lobbyist. Targets apply to the associated filing.
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2010 · fourth_quarter · Q4
Subsidies to foreign semiconductor manufacturers; issues related to unfair trade laws; issues related to the Byrd Amendment
Filing targets: SENATE, U.S. Customs & Border Protection, U.S. Trade Representative (USTR)
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2009 · first_quarter · Q1
Source: Senate LDA
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the Continued Dumping and Subsidy Offset Provision
Filing targets: SENATE, U.S. Customs & Border Protection
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2008 · fourth_quarter · Q4
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the Continued Dumping and Subsidy Offset Provision
Filing targets: Homeland Security, Dept of (DHS), SENATE
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2008 · third_quarter · Q3
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the Continued Dumping and Subsidy Offset Provision
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE, U.S. Trade Representative (USTR)
TILLOTSON CORPORATION via KING & SPALDING LLP
2008 · second_quarter · Q2
Trade and intellectual property protection issues
Filing targets: HOUSE OF REPRESENTATIVES, SENATE
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2008 · second_quarter · Q2
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the Continued Dumping and Subsidy Offset Provision
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE, U.S. Trade Representative (USTR)
BROADCOM CORPORATION via KING & SPALDING LLP
2008 · second_quarter · Q2
Issues regarding patent, international trade, and intellectual property matters
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2008 · first_quarter · Q1
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the Continued Dumping and Subsidy Offset Provision
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Trade Representative (USTR), White House Office
BROADCOM CORPORATION via KING & SPALDING LLP
2008 · first_quarter · Q1
Issues regarding patent, international trade, and intellectual property matters.
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Intl Trade Administration (ITA), SENATE
TILLOTSON CORPORATION via KING & SPALDING LLP
2008 · first_quarter · Q1
Trade and intellectual property protection issues
Filing targets: HOUSE OF REPRESENTATIVES, SENATE
TILLOTSON CORPORATION via KING & SPALDING LLP
2007 · year_end · YY
Trade and intellectual property protection issues
Filing targets: HOUSE OF REPRESENTATIVES, SENATE
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2007 · year_end · YY
Subsidies to Korean semiconductor manufacturers; Issues related to the unfair trade laws; Issues related to the World Trade Organization negotiations; Issues related to the Continued Dumping and Subsidy Offset Provision; Issues related to the rule of origin for semiconductors; Issues related to the proposed U.S.-Korea Free Trade Agreement
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. International Trade Commission (ITC), U.S. Trade Representative (USTR), White House Office
BROADCOM CORPORATION via KING & SPALDING LLP
2007 · year_end · YY
Issues regarding patent, international trade, and intellectual property matters.
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Intl Trade Administration (ITA), SENATE
TILLOTSON CORPORATION via KING & SPALDING LLP
2007 · year_end · RR
Trade and intellectual property protection issues with China
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2007 · mid_year · MM
Issues related to the rule of origin for semiconductors; Issues related to the proposed U.S.-Korea Free Trade Agreement Subsidies to Korean semiconductor manufacturers; issues related to the unfair trade laws; issues related to the World Trade Organization negotiations; issues related to the Continued Dumping and Subsidy Offset Provision;
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. International Trade Commission (ITC), U.S. Trade Representative (USTR), White House Office
BROADCOM CORPORATION via KING & SPALDING LLP
2007 · mid_year · MM
Issues regarding patent, international trade, and intellectual property matters
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, SENATE, U.S. International Trade Commission (ITC)
MICRON TECHNOLOGY INC via KING & SPALDING LLP
2006 · year_end · YY
Issues related to U.S. Export-Import Bank financing of semiconductor manufacturing equipment to China; Export-Import Bank Reauthorization Act of 2006 (H.R. 5068); Bills to temporarily suspend the duty on gold semiconductor bonding wire (H.R. 2469 and S. 1601); Issues related to the rule of origin for semiconductors; issues related to the proposed U.S.-Korea Free Trade Agreement Subsidies to Korean semiconductor manufacturers; issues related to the unfair trade laws; issues related to the World Trade Organization negotiations; issues related to the Continued Dumping and Subsidy Offset Provision;
Filing targets: Commerce, Dept of (DOC), Export-Import Bank of the United States (EXIM Bank), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Intl Trade Administration (ITA), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Trade Representative (USTR), White House Office
BROADCOM CORPORATION via KING & SPALDING LLP
2006 · year_end · YY
Issues regarding patent and international trade and intellectual property matters
Filing targets: Commerce, Dept of (DOC), HOUSE OF REPRESENTATIVES, SENATE, U.S. International Trade Commission (ITC)
BROADCOM CORPORATION via KING & SPALDING LLP
2006 · year_end · RR