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Reported covered position: US Senator Tina Smith, Legislative Assistant; US Senator Al Franken, Legislative Aide, Legislative Correspondent, and Interim Deputy Director of Scheduling
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Income and expense are whole-filing amounts associated with this lobbyist, not personal compensation or an allocated share.
No topic inference: each bill number appears in source LDA issue text assigned to this lobbyist.
BASIC ACT
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
BASIC ACT
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Specific issues are shown only where the LDA source assigned them to this lobbyist. Targets apply to the associated filing.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2026 · third_quarter · Q3
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration, e.g., proposed fees on visas. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Source: Senate LDA
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Export Controls Enforcement Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Export Controls Enforcement Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
SPEED Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate including process for new chemicals review and regulation of existing chemicals. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
SPEED Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
SPEED Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
GAIN AI Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
STRIDE Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
STRIDE Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
STRIDE Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
AI OVERWATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
AI OVERWATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
AI OVERWATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
RESTRICT Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Full AI Stack Export Promotion Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Full AI Stack Export Promotion Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
BIS STRENGTH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
BIS STRENGTH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
STAR Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
STAR Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
STAR Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
Interagency Coordination in Export Controls Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Interagency Coordination in Export Controls Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
MATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
MATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
MATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
MATCH Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
MATCH Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
MATCH Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Semiconductor Controls Effectiveness Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Semiconductor Controls Effectiveness Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
BIS Licensing Efficiency Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
BIS Licensing Efficiency Act of 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
National Defense Authorization Act for Fiscal Year 2027
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
National Defense Authorization Act for Fiscal Year 2027
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
A bill to amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
A bill to amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
A bill to amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
GAIN AI Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
SAFE Chips Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
SAFE Chips Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
SAFE Chips Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
AI OVERWATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
AI OVERWATCH Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
National Defense Authorization Act for Fiscal Year 2027
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
National Defense Authorization Act for Fiscal Year 2027
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Humane Cosmetics Act of 2021
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Humane Cosmetics Act of 2021
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Humane Cosmetics Act of 2021
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Charlotte Woodward Organ Transplant Discrimination Prevention Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Charlotte Woodward Organ Transplant Discrimination Prevention Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Charlotte Woodward Organ Transplant Discrimination Prevention Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
An act to provide for reconciliation pursuant to title II of H. Con. Res. 14.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
American Innovation and R&D Competitiveness Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L. 117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174.
American Innovation and R&D Competitiveness Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
American Innovation and R&D Competitiveness Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern under IRC section 45Y and 48E, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
BASIC ACT
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
BASIC ACT
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern under IRC section 45Y and 48E, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern under IRC section 45Y and 48E, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L. 117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174.
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
To amend the Internal Revenue Code of 1986 to provide special rules for the taxation of certain residents of Taiwan with income from sources within the United States.
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Chip Security Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; the Chip Security Act (S.1705/H.R. 3447); semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505).
Streamlining Procurement for Effective Execution and Delivery and National Defense Authorization Act for Fiscal Year 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Streamlining Procurement for Effective Execution and Delivery and National Defense Authorization Act for Fiscal Year 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Streamlining Procurement for Effective Execution and Delivery and National Defense Authorization Act for Fiscal Year 2026
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; the Chip Security Act (S.1705/H.R. 3447); semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505).
SPEED Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA). HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
SPEED Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA). HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
GAIN AI Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
GAIN AI Act of 2025
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
SEMI Investment Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Chip EQUIP Act
Client: SEMICONDUCTOR INDUSTRY ASSOCIATION · Firm: SEMICONDUCTOR INDUSTRY ASSOCIATION
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate including process for new chemicals review and regulation of existing chemicals. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2026 · second_quarter · Q2
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations; issues related to U.S national security and semiconductor supply chain resiliency; implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875/S.4456), SAFE Chips Act (S. 3374), MATCH Act (H.R. 8170), STRIDE Act (H.R. 6058), Interagency Coordination in Export Controls Act (H.R. 8036), (H.R. 6996), Export Controls Enforcement Act (H.R. 4505), BIS Licensing Efficiency Act (H.R. 8289), Semiconductor Controls Effectiveness Act (H.R. 8287), BIS STRENGTH Act (H.R. 7003), Chip EQUIP Act (H.R. 6207/S. 3301), and related amendments proposed to the National Defense Authorization Act for Fiscal Year 2027 (H.R. 8800/S. 4784).
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33), Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), SEMI Investment Act (H.R. 6055 /S. 1642), and BASIC Act (H.R. 3204).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2026 · first_quarter · Q1
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA) draft bills in House and Senate. HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Policy issues related to the extension of the advanced manufacturing investment credit (IRC section 48D) and direct payment of the credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. All sections of the United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33); Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802); SEMI Investment Act (H.R. 6055 /S. 1642).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, certain semiconductor manufacturing items, the illicit diversion of semiconductors, and related legislative policy matters, including: the Chip Security Act (H.R. 3447/S. 1705), GAIN AI Act (S. 3150/H.R. 5885), the CHIP Equip Act (H.R. 6207/S.3301), AI OVERWATCH Act (H.R. 6875), SAFE Chips Act (S. 3374), RESTRICT Act (H.R. 6879), MATCH Act (H.R. 8170), and the STRIDE Act (H.R. 6058)."
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) including the Modernizing Access to Talents, Credentials, and Hiring (MATCH) Act (H.R. 8183), and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301). Matters relating to the AI Action Plan and AI Export Promotion Plan.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2025 · fourth_quarter · 4A
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA). HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301).
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2025 · fourth_quarter · Q4
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, and certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246/S. 1053); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors. Chip Security Act (H.R. 3447/S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505, S. 3150, and H.R. 5885). The CHIP Equip Act (H.R. 6207/S. 3301). AI OVERWATCH Act (H.R. 6875). SAFE Chips Act (S. 3374). RESTRICT Act (H.R. 6879).).
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes (SPEED Act - H.R 4776). Reforms to the Toxic Substances Control Act (TSCA). HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip EQUIP Act (H.R. 6207/S. 3301).
Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit (IRC section 48D); tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802). SEMI Investment Act (H.R. 6055 /S. 1642). Implementation of the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an increase in the rate of the advanced manufacturing investment credit and matters related to, IRC section 174 expensing.
Technical education and work-based learning opportunities, including for veterans, opportunity and affordability in STEM and innovation, and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2025 · third_quarter · Q3
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip Equip Act (draft bill, introduction pending).
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (P.L. 119-21) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern under IRC section 45Y and 48E, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2025 · second_quarter · Q2
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2025 · first_quarter · Q1
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2024 · fourth_quarter · Q4
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, including provisions in the House and Senate FY25 Commerce, Justice, Science, and Related Agencies Appropriations Bill reports and the FY25 National Defense Authorization Act (P.L. 118-159).
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (P.L. 118-105). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678) and the Comprehensive Outbound Investment National Security (COINS) Act (H.R. 10559). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Legislation related to semiconductor hardware security. Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2024 · third_quarter · Q3
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, including provisions in the House and Senate FY25 Commerce, Justice, Science, and Related Agencies Appropriations Bill reports.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2024 · second_quarter · Q2
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (H.R. 8070) (export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924, and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip EQUIP Act (S. 4585). Legislation related to semiconductor hardware security.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2024 · first_quarter · Q1
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024).
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2023 · fourth_quarter · Q4
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Modernizing H-1B Requirements, Providing Flexibility in the F-1 Program, and Program Improvements Affecting Other Nonimmigrant Workers Proposed Rulemaking.
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2023 · third_quarter · Q3
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2023 · second_quarter · Q2
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (export control, outbound investment, NEPA, other).
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2023 · first_quarter · Q1
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Inquiry on the semiconductor supply chain. Issues related to U.S trade, national security, and semiconductor supply chain resiliency in relation to Taiwan.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2022 · fourth_quarter · Q4
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), H.R. 2617 Consolidated Appropriations Act FY2023; H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy, PFAS Action Act (HR 2467). Sale of Federal Helium System. A bill to include certain computer-related projects in the Federal permitting program under title XLI of the FAST Act, and for other purposes (S. 3451). Permitting reform, including NEPA process. H.R. 2617 Consolidated Appropriations Act FY2023 and H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
SEMICONDUCTOR INDUSTRY ASSOCIATION via SEMICONDUCTOR INDUSTRY ASSOCIATION
2022 · third_quarter · Q3
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy, PFAS Action Act (HR 2467). Sale of Federal Helium System. A bill to include certain computer-related projects in the Federal permitting program under title XLI of the FAST Act, and for other purposes (S. 3451).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, Military End Use/End User Export Controls, Ensuring American Global Leadership and Engagement Act (H.R. 3524), White House supply chain report under (EO 14017), U.S. Innovation and Competition Act/America COMPETES Act (S.1260; HR 4521), National Critical Capabilities Defense Act of 2021 (S. 1854, H.R. 6329). the CHIPS and Science Act of 2022 (H.R. 4346).
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics; the Chip Security Act (S.1705/H.R. 3447); semiconductor policy issues related to the FY26 National Defense Authorization Act (H.R. 3838; S. 2296), including export controls, outbound investment, issues related to DoDs procurement of microelectronics, the Chip Security Act and related amendments (S.Amdt.2905), and the GAIN AI Act (S.Amdt.3505).
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes. The Building Chips in America Act of 2023(P.L. 118-105), reforms to the Toxic Substances Control Act (TSCA). HFC application specific allowances and Technology Transfer Rule (TTR) under the AIM Act (P.L.116-260).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors (Section 232 and 301 investigations), and issues related to sectoral tariffs.
Technical education and work-based learning opportunities, opportunity and affordability in STEM and innovation, expansion of access to Pell Grants and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, ongoing trade investigations concerning semiconductors, and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip Security Act (H.R. 3447, S. 1705). Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes. The Building Chips in America Act of 2023 (P.L. 118-105), reforms to the Toxic Substances Control Act (TSCA). HFC allocations and Technology Transfer Rule (TTR) under the AIM Act (P.L. 116-260).
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167). Chip Equip Act (draft bill, introduction pending).
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L.117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174. All sections under the Building Advanced Semiconductors Investment Credit (BASIC) Act (H.R. 3204); all sections under the One Big Beautiful Bill Act (H.R. 1) pertaining to an extension, expansion, and increase in the rate of the advanced manufacturing investment credit and matters related to foreign entities of concern language under IRC section 48D, IRC section 174 expensing, Foreign-Derived Deduction Eligible Income (formerly FDII), proposed IRC section 899 on remedies against unfair foreign taxes, IRC section 163(j), and other business expensing matters.
Technical education and work-based learning opportunities, opportunity and affordability in STEM and innovation, expansion of access to Pell Grants and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, issues related to increasing demand and market access for U.S. manufactured semiconductors, strengthening trusted semiconductor supply chains, issues related to countering unfair trade practices and barriers, and issues related to sectoral tariffs.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, certain DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Foreign Investment Guardrails to Help Thwart (FIGHT) China Act (H.R. 2246, S. 1053). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 1316, S. 744); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Issues related to semiconductor hardware security. Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.
PFAS legislative and regulatory policy. Permitting reform, including streamlining of NEPA processes. The Building Chips in America Act of 2023 (P.L. 118-105), reforms to the Toxic Substances Control Act (TSCA). HFC allocations under the AIM Act (P.L. 116-260).
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education and research Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation and funding of the CHIPS and Science Act of 2022 (P.L. 117-167).
American Innovation and R&D Competitiveness Act (H.R. 1990). Policy issues related to the implementation of the CHIPS and Science Act (P.L. 117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities, United States-Taiwan Expedited Double-Tax Relief Act (S. 199 and H.R. 33). Semiconductor Technology Advancement and Research (STAR) Act (H.R. 802), extension of business provisions Tax Cuts and Jobs Act (TCJA) (P.L. 115-97) including Foreign Derived Intangible Income (FDII) and immediate deduction of R&D expenses under IRC section 174.
Technical education and work-based learning opportunities, opportunity and affordability in STEM and innovation, expansion of access to Pell Grants and increased funding for apprenticeship programs. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167), Reauthorization of the Workforce Innovation and Opportunity Act (WIOA) and Perkins Career and Technical Education Act, efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to the implementation of the CHIPS and Science Act (P.L. 117-167) advanced manufacturing investment credit; tax policy issues related to incentivizing semiconductor manufacturing, research and development, and design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act. United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024). Issues related to OECDs Pillar Two implementation. Semiconductor Technology Advancement and Research (STAR) Act (H.R. 9183).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167). Bipartisan Workforce Pell Act (H.R. 6585). A Stronger Workforce for America Act (H.R. 6655). Labor Certification for Permanent Employment of Foreign Workers in the United States; Modernizing Schedule A To Include Consideration of Additional Occupations in Science, Technology, Engineering, and Mathematics (STEM) and Non-STEM Occupations, Reauthorization of the Workforce Innovation and Opportunity Act (WIOA).Efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).Spectrum and National Security Act of 2024 (S. 4207).
PFAS legislative and regulatory policy. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (P.L. 118-105).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024). Issues related to OECDs Pillar Two implementation.Semiconductor Technology Advancement and Research (STAR) Act (H.R. 9183).
PFAS legislative and regulatory policy. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (H.R. 8070) (export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip EQUIP Act (S. 4585). Legislation related to semiconductor hardware security.Issues related to guardrails on CHIPS Act funding.
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).Spectrum and National Security Act of 2024 (S. 4207).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167). Bipartisan Workforce Pell Act (H.R. 6585). A Stronger Workforce for America Act (H.R. 6655). Labor Certification for Permanent Employment of Foreign Workers in the United States; Modernizing Schedule A To Include Consideration of Additional Occupations in Science, Technology, Engineering, and Mathematics (STEM) and Non-STEM Occupations, Reauthorization of the Workforce Innovation and Opportunity Act (WIOA).Efforts related to the establishment of workforce development programs associated with the CHIPS and Science Act (P.L. 117-167) and implemented by NSF and the Dept. of Commerce.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing. Issues regarding USTR Withdrawal of US Digital Trade Priorities at WTO. Secure renewal of the WTO e-commerce moratorium.
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167). Bipartisan Workforce Pell Act (H.R. 6585). A Stronger Workforce for America Act (H.R. 6655). Labor Certification for Permanent Employment of Foreign Workers in the United States; Modernizing Schedule A To Include Consideration of Additional Occupations in Science, Technology, Engineering, and Mathematics (STEM) and Non-STEM Occupations, Reauthorization of the Workforce Innovation and Opportunity Act (WIOA).
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).Tax Relief for American Families and Workers Act of 2024 (H.R. 7024). Issues related to OECDs Pillar Two implementation.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Labor, Dept of (DOL), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (S. 2226, H.R. 2670) (export control, outbound investment, NEPA, other). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760).Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614); increasing transparency in customs anticounterfeiting and intellectual property protection efforts (S.Amdt.484 to S. 2226, National Defense Authorization Act for Fiscal Year 2024).Export Control Enforcement and Enhancement Act (H.R. 7151); legislation to amend the Export Control Reform Act of 2018 relating to the review of the interagency dispute resolution process (H.R. 6602);policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167). Bipartisan Workforce Pell Act (H.R. 6585). A Stronger Workforce for America Act (H.R. 6655).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration. Issues related to expanding and increasing employment-based immigration for high-skilled workers in STEM; Policy issues related to increasing efficiency and flexibility of employment-based immigration programs.
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing. Issues regarding USTR Withdrawal of US Digital Trade Priorities at WTO. Policy matters related to MC13 to encourage Vietnam to join the WTO Information Technology Agreement Expansion (ITA2) and secure renewal of the WTO e-commerce moratorium.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process and returns in Fiscal Responsibility Act and FY24 NDAA. The Building Chips in America Act of 2023 (S. 2228, H.R. 4549).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.Issues regarding USTR Withdrawal of US Digital Trade Priorities at WTO; A resolution expressing the sense of the Senate that the United States should negotiate strong, inclusive, and forward-looking rules on digital trade and the digital economy with like-minded countries as part of its broader trade and economic strategy in order to ensure that the United States values of democracy, rule of law, freedom of speech, human and worker rights, privacy, and a free and open internet are at the very core of digital governance (S.Res.155).
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.United States-Taiwan Expedited Double-Tax Relief Act (S. 3084 and H.R. 5988).
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (S. 2226, H.R. 2670) (export control, outbound investment, NEPA, other). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760).Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614); increasing transparency in customs anticounterfeiting and intellectual property protection efforts (S.Amdt.484 to S. 2226, National Defense Authorization Act for Fiscal Year 2024).
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities. Taiwan Tax Agreement Act (H.R. 4729, S. 1457), U.S.-Taiwan Expedited Double Tax Relief Act.
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S trade, national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 24 National Defense Authorization Act (S. 2226, H.R. 2670) (export control, outbound investment, NEPA, other). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration.
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).
Science Research Funding, NIST Funding, Funding for Regional Technology and Innovation Hubs, NSF funding, research and funding related to Trusted and Assured Microelectronics, STEM Education Initiatives as authorized by CHIPS & Science Act (P.L. 117-167).
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities, Taiwan tax agreement.
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, White House supply chain report under (EO 14017) expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration; including proposed rules on fees.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept ofCommerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), as authorized by CHIPS & Science Act (P.L. 117-167).
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873. Implementation of the CHIPS and Science Act of 2022 (P.L. 117-167).
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses,White House supply chain report under (EO 14017) and expansion of the World Trade Organization (WTO) Information Technology Agreement (ITA); Semiconductor supply chain rebalancing.
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities; Executive action on high skilled immigration; including proposed rules on fees.
American Innovation and Jobs Act (S. 866); American Innovation and R&D Competitiveness Act H.R. 2673. Policy issues related to Treasury proposed regulations on 48D of the CHIPS and Science Act (P.L. 117-167); tax policy issues related to incentivizing research and development and semiconductor design activities
Technical education and work-based learning opportunities, opportunity and equity in STEM and innovation, expansion of access to Pell Grants. Funding for workforce development as authorized by the CHIPS & Science Act (P.L. 117-167).
American Innovation and Manufacturing (AIM) Act (enacted as part of the Consolidated Appropriations Act of 2020 (P.L. 116-260)), PFAS legislative and regulatory policy. Sale of Federal Helium System and resiliency of the helium supply chain. Permitting reform, including NEPA process.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, sect. 889 implementation (P.L. 115-232), sect. 224 implementation (P.L. 116-92), DOD appropriations, DARPA ERI Program. Inquiry on the semiconductor supply chain. H.R. 2617 Consolidated Appropriations Act FY2023 and H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities, Executive action on high skilled immigration, Equal Access to Green Cards for Legal Employment Act of 2021 (H.R. 3648); employment visa proposals in appropriations package, H.R. 2617 Consolidated Appropriations Act FY2023 and H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873, general cybersecurity issues, H.R. 2617 Consolidated Appropriations Act FY2023 and H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
Export Control Reform Act (P.L. 115-232) implementation, potential controls on emerging and foundational technologies, matters related to Commerce Department Entity list and export licenses, Military End Use/End User Export Controls, Ensuring American Global Leadership and Engagement Act (H.R. 3524), White House supply chain report under (EO 14017).
American Innovation and Jobs Act (S. 749; H.R. 1304), Facilitating American-Built Semiconductors (FABS) Act (S.2107; H.R. 7104), American Innovation and Jobs Act (S. 749)/American Innovation and R&D Competitiveness Act of 2021 (H.R. 1304). Facilitating American-Built Semiconductors (FABS) Act (S. 2107; H.R. 7104), Corporate tax proposals in reconciliation package, H.R. 2617 Consolidated Appropriations Act FY2023 and H.R. 7776 the James Inhofe National Defense Authorization Act for Fiscal Year 2023.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office
American Innovation and Jobs Act (S. 749; H.R. 1304), Facilitating American-Built Semiconductors (FABS) Act (S.2107; H.R. 7104), American Innovation and Jobs Act (S. 749)/American Innovation and R&D Competitiveness Act of 2021 (H.R. 1304). Facilitating American-Built Semiconductors (FABS) Act (S. 2107; H.R. 7104), Corporate tax proposals in reconciliation package. U.S. Innovation and Competition Act (USICA) (S.1260); America COMPETES Act (H.R. 4521). H.R. 4346 the CHIPS and Science Act of 2022, H.R. 5376 Inflation Reduction Act of 2022.
Americas Supply Chains Executive Order 14017, ICTS Supply Chain Executive Order 13873, general cybersecurity issues, U.S. Innovation and Competition Act/America COMPETES Act (S.1260; HR 4521), Ensuring American Global Leadership and Engagement Act (H.R. 3524), Inquiry on the semiconductor supply chain. H.R. 4346 the CHIPS and Science Act of 2022.
Visa Policy & Procedures, Visas for Highly Skilled Immigrants & Foreign Graduates of U.S. Universities, Executive action on high skilled immigration, Equal Access to Green Cards for Legal Employment Act of 2021 (H.R. 3648); employment visa proposals in reconciliation package, U.S. Innovation and Competition Act/America COMPETES Act (S.1260; HR 4521); the CHIPS and Science Act of 2022 (H.R. 4346).
Federal expenditures on semiconductor R&D, semiconductor manufacturing incentives, basic research and education (Appropriations for Dept of Commerce, NSF, NIST, DARPA, Dept of Defense, Dept of Energy), H.R. 4346 the CHIPS and Science Act of 2022, U.S. Innovation and Competition Act/America COMPETES Act (S.1260; HR 4521), NSF For the Future Act (H.R. 2225), DOE Science for the Future Act (H.R. 3593).
Export control reform initiatives, cybersecurity, industrial base policy, the CHIPS and Science Act of 2022 (H.R. 4346), National Semiconductor Technology Center, DARPA Microelectronics Commons, sect. 889 implementation (P.L. 115-232), sect. 224 implementation (P.L. 116-92), DOD appropriations, DARPA ERI Program, U.S. Innovation and Competition Act/America COMPETES Act (S.1260; HR 4521), Ensuring American Global Leadership and Engagement Act (H.R. 3524). Inquiry on the semiconductor supply chain.
Filing targets: Bureau of Land Management (BLM), Commerce, Dept of (DOC), Defense Advanced Research Projects Agency (DARPA), Defense, Dept of (DOD), Energy, Dept of, Environmental Protection Agency (EPA), Executive Office of the President (EOP), General Services Administration (GSA), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Economic Council (NEC), Natl Institute of Standards & Technology (NIST), Natl Science Foundation (NSF), Natl Security Council (NSC), Office of Science & Technology Policy (OSTP), SENATE, State, Dept of (DOS), Treasury, Dept of, U.S. Customs & Border Protection, U.S. Trade Representative (USTR), White House Office