Loading…
Legislative Progress
Momentum (last 30 days)
0
score
0 actions · 0 new cosponsors · 0 votes
Speed vs cohort
0pct
0d open
vs 10,564 other HR bills in the 118th — cohort avg 68d
No CRS summary is available for this bill yet. The source title, actions, sponsors, and text versions below come from Congress.gov.
These links require the bill number to appear in the filing's source-reported specific issue text. Client expenses and lobbying-firm income are separate disclosure fields.
Filing registrants (3)
2024 · fourth_quarter · Defense
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (P.L. 118-159; export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (P.L. 118-105). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678) and the Comprehensive Outbound Investment National Security (COINS) Act (H.R. 10559). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Legislation related to semiconductor hardware security. Issues related to guardrails on CHIPS Act funding. Proposed regulation on Export Control Framework for AI diffusion. Issues related to DoDs procurement of microelectronics.
Referred to the Committee on Energy and Commerce, and in addition to the Committee on Science, Space, and Technology, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
Introduced in House
Congress.gov source codes: 1000, Intro-H
Bills with similar content found using semantic analysis.
Sources: Congress.gov
Client expense: $300,000 · Firm income: Not reported
Government targets: Commerce, Dept of (DOC), Defense, Dept of (DOD), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Security Council (NSC), SENATE, State, Dept of (DOS), Treasury, Dept of, White House Office
2024 · fourth_quarter · Manufacturing
CHIPS and Science Act (Public Law 117-167) implementation; S. 4585 and H.R. 8826, Chip Equipment Quality, Usefulness, And Integrity Protection (Chip Equip) Act; S. 1956, Invent Here, Make Here Act of 2024, S. 2228, Building Chips in America Act Issues related to Bayh-Dole and domestic manufacturing, federal incentives for semiconductor manufacturing, CHIPS Act funding and implementation, artificial intelligence chips, and supply chain resiliency
Client expense: $1,120,000 · Firm income: Not reported
Government targets: Commerce, Dept of (DOC), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, SENATE
2024 · fourth_quarter · Science/Technology
CHIPS and Science Act (Public Law 117-167); S. 4585 and H.R. 8826, Chip Equipment Quality, Usefulness, And Integrity Protection (Chip Equip) Act; S. 1956, Invent Here, Make Here Act of 2024 Issues related to the implementation of the National Semiconductor Technology Center, federal incentives for semiconductor research and development and manufacturing, CHIPS Act funding and implementation, semiconductor security, and artificial intelligence
Client expense: $1,120,000 · Firm income: Not reported
Government targets: Commerce, Dept of (DOC), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, SENATE
2024 · fourth_quarter · Manufacturing
National Defense Authorization Act for Fiscal Year 2025 (Public Law No. 118-31); S.4585/H.R.8826 Chip EQUIP Act of 2024
Client expense: Not reported · Firm income: $60,000
Government targets: HOUSE OF REPRESENTATIVES, SENATE
2024 · third_quarter · Science/Technology
CHIPS and Science Act (Public Law 117-167); S. 4585 and H.R. 8826, Chip Equipment Quality, Usefulness, And Integrity Protection (Chip Equip) Act; S. 1956, Invent Here, Make Here Act of 2024 Issues related to the implementation of the National Semiconductor Technology Center, federal incentives for semiconductor research and development and manufacturing, CHIPS Act funding and implementation, semiconductor security, artificial intelligence, quantum computing, National Quantum Initiative
Client expense: $1,600,000 · Firm income: Not reported
Government targets: Commerce, Dept of (DOC), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, SENATE
2024 · third_quarter · Manufacturing
CHIPS and Science Act (Public Law 117-167) implementation; S. 4585 and H.R. 8826, Chip Equipment Quality, Usefulness, And Integrity Protection (Chip Equip) Act; S. 1956, Invent Here, Make Here Act of 2024, S. 2228, Building Chips in America Act Issues related to Bayh-Dole and domestic manufacturing, federal incentives for semiconductor manufacturing, CHIPS Act funding and implementation, and supply chain resiliency
Client expense: $1,600,000 · Firm income: Not reported
Government targets: Commerce, Dept of (DOC), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, SENATE
2024 · third_quarter · Manufacturing
H.R. 8070/S. 4638 National Defense Authorization Act for Fiscal Year 2025. S. 4585/H.R. 8826 Chip EQUIP Act of 2024.
Client expense: Not reported · Firm income: $60,000
2024 · third_quarter · Defense
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (H.R. 8070) (export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 6606, H.R. 5613, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924), and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip EQUIP Act (S. 4585). Legislation related to semiconductor hardware security.Issues related to guardrails on CHIPS Act funding.
Client expense: $400,000 · Firm income: Not reported
2024 · second_quarter · Defense
Export control reform initiatives, cybersecurity, industrial base policy, National Semiconductor Technology Center, DARPA Microelectronics Commons, Trusted and Assured Microelectronics Program, sect. DOD appropriations, DARPA ERI Program. Issues related to U.S national security and semiconductor supply chain resiliency in relation to Taiwan. Semiconductor policy issues related to the FY 25 National Defense Authorization Act (H.R. 8070) (export control, outbound investment, NEPA, and other semiconductor related matters). The Building Chips in America Act of 2023 (S. 2228, H.R. 4549). Implementation of the CHIPS and Science Act of 2022 (PL 117-167). The Chip Equipment, Quality, Usefulness, and Integrity Protection (Chip EQUIP) Act (S. 4585, H.R. 8826). Outbound Investment Transparency Act of 2023 (S.2678). Chinese Military and Surveillance Company Sanctions Act of 2023 (H.R.760). Maintaining American Superiority by Improving Export Control Transparency Act (H.R. 6614). Various measures under consideration by the House Foreign Affairs Committee (H.R. 6602, H.R. 7151, H.R. 8152, H.R. 8315, H.R. 8924, and the Preventing Regional Catastrophes in 2027 Act); policy matters related to the Export Administration Regulations (EAR) controls on advanced computing integrated circuits (ICs), computer commodities that contain such ICs, and certain semiconductor manufacturing items; policy matters related to the illicit diversion of semiconductors to Russia. Chip EQUIP Act (S. 4585). Legislation related to semiconductor hardware security.
Client expense: $408,000 · Firm income: Not reported
Government targets: HOUSE OF REPRESENTATIVES, SENATE
Government targets: Commerce, Dept of (DOC), Defense, Dept of (DOD), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Security Council (NSC), SENATE, State, Dept of (DOS), Treasury, Dept of, White House Office
Government targets: Commerce, Dept of (DOC), Defense, Dept of (DOD), Executive Office of the President (EOP), HOUSE OF REPRESENTATIVES, Homeland Security, Dept of (DHS), Natl Security Council (NSC), SENATE, State, Dept of (DOS), Treasury, Dept of, White House Office